Samsung Electronics' advanced packaging business, Samsung Advanced Package Technology(AVP), has successfully garnered the attention of Nvidia by providing interposer and 2.5D packaging (I-Cube) solutions.
Amy Fan is a data reporter specializing in technology and business. With a focus on the semiconductor industry, Amy's work has been featured in DIGITIMES Asia, Scripps News, Newsy, and ABC15 Arizona. She covers topics such as AI innovations, smartphone market trends, and corporate developments in the tech sector.