Chad Cox

Axiomtek launched the compact (100 x 72 mm) PICO570, its recent Pico-ITX single board computer leveraging Intel Core Ultra processors (Series 1) for AI applications at the edge and an integrated NPU offering up to 11 TOPS.

Sundance DSP introduced the FG650-Polarfire, a variant of the company’s proven FG650 Four‑Channel Camera Link Frame Grabber that is executed on the Microchip PolarFire FPGA family. It is fully compatible with Sundance DSP’s Polarfire SOMs and carrier boards, allowing designers the ability to integrate high‑bandwidth imaging pipelines directly into heterogeneous compute systems combining FPGA acceleration, embedded processors, and edge‑AI capabilities.

Avalue Technology released its HPS-GNRU1A 1U rackmount server platform and the HPM-GNRUP industrial server board, merging the Intel Xeon 6 platform, PCIe Gen5 architecture, and high-density NVMe storage to offer customizable solutions for centralized data centers. The solution delivers up to 350W TDP and integrates PCIe Gen5 architecture with dual 10GbE LAN interfaces to meet the demands of high-speed data transfer and low-latency computing demands.

Kardome’s Spatial Hearing AI for human-like voice localization and isolation is now being integrated into LG’s OLED TVs. The technology allows the TVs to locate and focus on individual speech with human-like accuracy, even when background noise is high.

Visitors to COMPUTEX 2026 (Taipei Nangang Exhibition Center) will want to visit Booth R1014, Hall 2, 4F where Seasonic is set to introduce its new flagship power platform for AI, PRIME ENTERPRISE. Attendees will also witness Seasonic’s innovative ultra-efficient power development inspired by emerging 80 PLUS Ruby standards and the latest evolution of OptiGuard intelligent protection technology.

NEXCOM will be a prominent force at COMPUTEX 2026 where it will be partnering with Intel in TWTC Hall 1, Booth A0618 at the "Robotics & Edge AI Pavilion". The booth theme will be "Physical AI and Manufacturing On-Site," where NEXCOM will show how Physical AI is accomplished by integrating visual perception and high-precision real-time motion control.

During COMPUTEX 2026, Aetina Corporation will demonstrate its latest innovations in edge AI solutions in Hall 1, Booth K0106. The booth will highlight Aetina’s portfolio including SuperEdge, MegaEdge, DeviceEdge and CoreEdge along with real-time interactive demonstrations co-developed with strategic partners and ecosystem innovators. The exhibition will show how edge AI is progressing from single inference models into integrated applications with contextual intelligence across Physical AI, Vision AI, and Agentic AI.

MSI IPC will attend COMPUTEX 2026 (June 2–5, Taipei Nangang Exhibition Center), where At Booth J0605a, Hall 1 (1F), it will introduce its latest innovations in Edge AI and how its products are transforming global industry.

ASRock Industrial will be at Booth R0514 during COMPUTEX Taipei 2026. From June 2 to June 5 the company will discuss how “Edge AI, Secure and Open” is defining the next generation of intelligent industrial computing. Live demonstrations will highlight the progression of Edge AI across agentic AI, physical AI, cybersecurity, and open automation. Presented will be ASRock Industrial portfolio of its industrial Edge AIoT platforms, embedded computer systems, and industrial motherboards.

BIWIN is attending COMPUTEX 2026 where it will showcase its innovative enterprise SSDs at Hall 2, Booth 4F, R0102. The company will showcase its SP50Y/51Y and SS821 solutions.