James Morra is a senior editor at Electronic Design. He covers the semiconductor industry and new technology trends, focusing on power electronics, power management, and the business aspects of electrical engineering, including the electronics supply chain. His work has been featured in IndustryWeek and Electronic Design.
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James Morra's coverage focuses predominantly on press releases and industry-specific topics related to engineering, silicon, AI, chip industry, and electronic design. He seems particularly interested in new technological developments and innovations within these fields.
For effective outreach, consider providing him with exclusive insights or expert commentary from professionals directly involved in the creation or implementation of cutting-edge technologies such as AI chips, semiconductor devices for renewable energy applications, advanced consumer electronics components like high-power charging systems for electric vehicles. Additionally, if you have access to significant data regarding recent technological advancements that align with his areas of interest it could be valuable.
Since James does not specify a geographic focus for his articles but covers international technology trends extensively given the nature of tech innovation being globalized.
This information evolves through artificial intelligence and human feedback. Improve this profile .
Molex's multi-channel liquid-cooled busbars remove heat more uniformly from the data center's power backbone than single-channel designs.
By: William G. Wong, James Morra, Roger Engelke, Andy Turudic, Cabe Atwell
Check out the latest stories, videos, and podcasts from the week of June 22, 2026.
Navitas' new isolated, direct-cooled TO-247-4 package is purpose-built for high-voltage SiC MOSFETs.
Which graphics chip was the most important on the GPU's road to AI dominance?
The deal fills a gap in onsemi's portfolio by adding Synaptics' edge compute and wireless connectivity solutions.
By: James Morra
The automotive-grade device developed by Vishay stays on top of the demands of 800-V battery architectures by supporting isolation voltages of up to 5,000 V RMS.
Toshiba said its latest 80-V MOSFET reduces on-resistance by more than 25% compared to its predecessor, suiting the FET for high-current power conversion.
Chips made at the new Dresden fab will support everything from AI data centers to the electric grids, battery storage systems, and renewable energy systems feeding them.
By: Andy Turudic, Roger Engelke, Cabe Atwell, James Morra, William G. Wong
Check out the latest stories, videos, and podcasts from the week of July 6, 2026.
The company is replacing hard-to-find high bandwidth memory (HBM) with LPDDR5X in its latest Versal processor.
