Luke James

Rook's numbers check out on paper. Hop Aero, a six-person Y Combinator startup based in Orange, California, has published the first public

Chinese civilian drone exports to the US fell 60% to 70% year over year after DJI's listing.

Chinese suppliers hold under 1% of ArF immersion resist.

Packaging materials account for roughly a third of a power module's cost, and in modern SiC modules, they increasingly set its lifetime too. A silver-sintered die attach survives around 22 times more power cycles than a soldered one in Infineon's published testing, a silicon nitride AMB substrate withstands 5,000 thermal shock cycles where standard alumina DBC fails at 55, and embedding the die in the substrate cuts commutation loop inductance from tens of nanohenries to roughly one.

Nvidia put $2 billion each into Lumentum and Coherent. Between them, they hold most of the world's indium phosphide capacity.

Apple's filings show the size of the buffer absorbing the DRAM shock.

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In this edition of Business Shorts, SK Group and Nvidia plan $500 billion in AI infrastructure, TDK and LG Innotek team up on robotic sensing, and Micron locks in automotive memory supply.

The PoE solution injects IEEE 802.3bt power onto existing Ethernet runs and operates from -40°C to 75°C, targeting factory and outdoor deployments where switch upgrades are impractical.

China's toolmakers now outsell KLA in etch and deposition, but lithography is stuck at five machines a year against ASML's 130.