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Mike Buetow's coverage focuses on the design and manufacturing of printed circuit boards (PCBs), particularly within the consumer electronics industry. His articles often feature press releases and private sector announcements, indicating a preference for news directly from companies.
If you are looking to reach out to Mike, consider providing insights or data related to PCB design trends, innovations in consumer electronics technology, or developments within prominent companies such as TTM Technologies or Foxconn. Industry professionals with knowledge of supply chain security and its impact on PCB manufacturing may also find resonance in his reporting.
While there is no specific geographic focus mentioned, Mike seems to cover global industry developments rather than focusing on a particular region.
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By: Mike Buetow
Incap Estonia has strengthened the quality of its production with the addition of a new high-precision flying probe system. The investment enhances the factory’s ability to meet the diverse needs of customers with a fast-evolving and diverse product portfolio.
By: Mike Buetow
FREUDENSTADT, GERMANY - Driven by AI server board and high-performance computing momentum, Schmid Group reported preliminary bookings of about 95 million euros for 2025,
Son, 18 December 2025 Sascha Brüning brings more than a decade of senior leadership experience within the defense industry, combining strategic oversight with operational expertise.
By: Mike Buetow
BRUSSELS -- Following on from the Annual General Meeting held during Productronica in Munich, the members of the EIPC Board were asked to choose a new President, Vice Presidents and treasurer. Until now the Institute has been magnificently served by Mr. Alun Morgan, of Ventec, who has held the office since 2012, having been re-elected at the end of each term of office.
Minneapolis, MN – The SMTA is excited to announce the technical program for the 2026 Wafer-Level Packaging Symposium. The symposium will be held February 17-19, 2026 at The Hyatt Regency San Francisco Airport in San Francisco, California.
TOKYO – Toppan has constructed a new manufacturing line at its Niigata plant for flip chip-ball grid array (FC-BGA) substrates.
By: Mike Buetow
SHENZHEN, CN / ACCESS Newswire / December 31, 2025 / PCBsync, a trusted name in PCB assembly and electronic manufacturing service, today announced the launch of its comprehensive full-scale electronic manufacturing service platform. This strategic expansion positions PCBsync as a complete turnkey solution provider for businesses seeking reliable PCB assembly services combined with advanced electronic manufacturing service capabilities.
By: Mike Buetow
Austin, Texas, Jan 01, 2026 — Magic Leap today announced it has signed an agreement with Pegatron, a leading global electronics manufacturer, to collaborate on the production of augmented reality (AR) glasses components. Under the agreement, Pegatron will leverage its high-volume manufacturing capabilities to support the scaled production of Magic Leap’s AR components, including its industry-leading waveguides.
By: Mike Buetow
Many years ago, in The Dark Knight, Batman’s nemesis the Joker famously observed that nobody panics when things go “according to plan – even if the plan is horrifying.” It’s when the unexpected happens that chaos erupts.
By: Mike Buetow
ATLANTA -- Component sales sentiment remained strong in April, declining 2.6 points overall to 146.6, as growth expectations for passives were offset by a slower outlook for other parts.
