Nick Flaherty is the Editor In Chief at eeNews Europe. He specializes in technology journalism, focusing on deep tech, software, automotive, and engineering, with a keen interest in AI, 5G, and the Internet of Things. Nick has been featured in The Business Herald, eeNews Europe, and Design And Reuse.
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Nick Flaherty's coverage is predominantly focused on technology, with a specific emphasis on consumer electronics, software & SaaS, automotive industry, and design. His articles heavily feature press releases and private sector announcements.
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By: Nick Flaherty
Blue Cheetah Analog Design has taped outs designs of its next generation BlueLynx die-to-die (D2D) chiplet PHY on Samsung Foundry's SF4X 4nm
By: Nick Flaherty
TDK is backing stealth start-up NovoLinc for its high-performance thermal interface material for data centre chips.
Keysight Technologies has added support for both interconnect standards to the latest version of its Chiplet PHY Designer 2025 design tool.
European universal chip designer Tachyum has added all four post-quantum cryptography (PQC) algorithms to its Prodigy software distributions.
UK/US quantum company Quantinuum is to build a cutting-edge research and development hub in New Mexico for photonic technology.
SemiQ has launched a series of 1700 V silicon carbide (SiC) MOSFETs for medium-voltage high power conversion applications.
TDK has launched the industry’s highest capacity multilayer ceramic capacitors (MLCCs) at 1250V in a 3225 form factor.
Element Six (E6) has developed a copper-diamond composite material with high thermal conductivity for cooling AI chips and GaN RF.
Wolfspeed has launched its fourth generation silicon carbide (SiC) technology platform for 1200V and 2300V power applications.
ARM and its owner Softbank are a key partners in a $100bn datacentre infrastructure programme in the US called Stargate.
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