Shannon Davis

Today, the U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. to provide up to $70 million in proposed direct funding under the CHIPS and Science Act. The proposed CHIPS funding would support the expansion and modernization of MACOM's facilities in Lowell, Massachusetts, and Durham, North Carolina, and would create up to 350 manufacturing jobs and nearly 60 construction jobs across both states.

TECHCET — the electronic materials advisory firm providing semiconductor materials supply chain information — is anticipating growth of near 8% for

Today, the U.S. Department of Commerce announced the signing of four separate non-binding preliminary memoranda of terms (PMT) under the CHIPS and

Infinera announced up to $93 million in federal funding to expand operations, including in the Lehigh Valley.

Today, the U.S. Department of Commerce announced it finalized three separate awards under the CHIPS Incentives Program's Funding Opportunity for Commercial Fabrication Facilities. The Department awarded Corning up to $32 million in direct funding, it awarded Edwards Vacuum up to $18 million in direct funding, and it awarded Infinera up to $93 million in direct funding. The awards come after the previously signed preliminary memoranda of terms, announced on November 8, 2024, October 10, 2024, and October 17, 2024, respectively, and the completion of the Department's due diligence. The Department will disburse the funds based on the companies' completion of project milestones.

produced IR-63 M unit – GF's state-of-the-art infrared welding machine – dedicated to Gradiant's R&D efforts. The collaboration aims to address the growing demands of the microelectronics and water industry, where precision, sustainability, and innovation are critical to success.

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Soitec announces the appointment of Ruth Hernandez as Chief Sales Officer. She will join the Executive Committee with responsibility for driving Soitec's commercial success.

Micross Components, Inc., a provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, today closed the acquisition of Integra Technologies. Integra is an Outsourced Semiconductor Assembly and Test (OSAT) post-processing provider focused on high-reliability applications and end markets, headquartered in

The Advanced Semiconductor Packaging Market, valued at US$ 30.1 Bn in 2022, is poised for steady expansion. Projected to grow at a CAGR of 5.2% from 2023 to 2031, the market is expected to reach