EE World Online

has introduced the MM8108-M20, a Wi‑Fi HaLow module for the 902-928 MHz band that measures 18.5 mm × 14 mm and supports 1, 2, 4 and 8 MHz channel bandwidths. The FCC/IC-certified module includes a high-power amplifier with up to 28.5 dBm transmit output power, a SAW filter and USB 2.0 High-Speed, SDIO 2.0 and SPI host interfaces, helping developers add long-range sub-GHz Wi‑Fi to products such as surveillance cameras and access points with a single-stream PHY rate up to 43.3 Mbps.

Amphenol RF has added a straight jack SMA connector for 0.085″ conformable cable, intended for RF and microwave applications including laboratory testing and industrial infrastructure. The connector uses a gold-plated stainless-steel body and gold-plated beryllium copper contact, supports frequencies up to 18 GHz with low VSWR and is compatible with standard SMA interfaces for board-to-panel and module designs.

Series high current chip ferrite beads for EMI suppression in dense PCB layouts, combining a 3.2 × 1.6 × 1.1 mm package with rated current up to 11 A and DC resistance as low as 0.0025 Ω. The series offers impedance values from 30 Ω to 1000 Ω at 100 MHz and operates from −55 °C to +125 °C, giving designers options for power rails, power lines and compact electronic systems where low insertion loss and thermal stability are important.

Microchip Technology has introduced XpressConnect™ PCIe® 6.0 and CXL® 3.1 retimers for AI data center fabrics, designed to extend signal reach at 64 GT/s for memory expansion and resource disaggregation across baseboards, riser cards and cabled interconnects. The retimers provide less than 12 ns pin-to-pin latency, support PCIe Gen 3 through Gen 6 platforms, offer link bifurcation options including 1×16, 2×8 and 4×4 and connect to the ChipLink diagnostic ecosystem to help operators monitor link health, simplify troubleshooting and improve accelerator and GPU utilization.

Bourns has added the PF-000100E, PF-01N100E, and PF-1NH100E series to its Bourns® POWrFuse™ high-power fuse family for semiconductor and battery protection in power conversion devices, DC systems, DC common bus systems, battery energy storage systems and DC charging piles. These bolt-down, DIN bolt or flush-end fuse links are designed to meet UL 248-13 and/or IEC 60269-4 and IEC 60269-7 requirements, with rated voltages of 800 VDC to 1000 VDC, rated current ranges from 50 A to 630 A and interrupting ratings up to 50 kA.

SSK family rectangular connectors to its interconnect portfolio, including male pin headers, female pin headers and box headers in one- and two-row configurations with 1 to 40 pins, 2.54 mm pitch and gold flash contacts. The through-hole connectors use straight pins and push-pull fastening, and are rated for 250 Vdc, 3 A and -40 to 105°C with 6 mm mating contact length and 3 mm post length. For board-to-board connections, the range gives designers multiple header styles and pin counts in a common format for standard PCB assembly.

Samtec, Inc. is a 1.27 mm centerline terminal strip available in surface-mount and through-hole versions with vertical and right-angle orientations, supporting 2 to 50 pins per row with selective gold/tin plating options. The connector family includes shrouds, locking clips, guideposts, pick-and-place pads, keying shrouds and tape-and-reel packaging, and it is commonly used for JTAG and board-level interconnect applications with mating ribbon cable assemblies. For embedded, industrial and automotive designs, the series provides configurable interconnect options, next-day volume availability and compliance with RoHS, Severe Environment Testing and Extended Life Product™ requirements.

Amphenol RF has introduced its first NEX10 4-hole flange jack connector for 1.37 mm cable, supporting broadband performance up to 6 GHz in compact RF systems and high-density wireless infrastructure. The connector uses a flange-mounted interface for secure panel attachment and combines a white bronze plated brass body with silver- and gold-plated contacts and a PTFE insulator to provide mechanical stability and low PIM performance. It is intended for distributed antenna systems, small cell deployments and other space-constrained communication equipment where reliable electrical performance and efficient cable routing are required.

The 2.92 mm connectors from Amphenol RF are vertical PCB jacks for stripline and microstrip designs that use a solderless threaded interface to reduce solder joint variability in microwave and millimeter-wave systems. They support broadband performance up to 40 GHz, maintain impedance across different PCB stackups and allow installation, removal and reuse during prototyping and RF validation. Built with passivated stainless steel bodies, gold-plated beryllium copper contacts and ULTEM insulators, the connectors are designed for test and measurement, advanced communications, aerospace and defense applications that need repeatable mechanical attachment and consistent signal integrity.

STMicroelectronics has introduced the IIS3DWB10IS, an industrial vibration sensor with ISPU 2.0 for condition monitoring applications that need edge signal processing, AI inference and operation in harsh environments. The device measures vibrations and shocks up to 200g at frequencies of 10 kHz and above, supports operating temperatures up to 125°C and provides 40 MIPS and 40 MFLOPS digital signal processing with hardware accelerators for real-time analysis. For industrial equipment such as rotating machinery, the sensor is intended to support predictive maintenance, reduce unplanned downtime and improve equipment uptime with processing closer to the sensing element.