Ann Mutschler is the Executive Editor at EDA. She specializes in areas such as AI and machine learning, deep tech, automotive, and engineering, with a keen focus on topics like security, cyber crime, and ESG. Ann's insights and expertise have been featured in Semiconductor Engineering.
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Ann Mutschler's coverage primarily focuses on the semiconductor industry, chip design, and emerging technologies such as AI/ML/DL. She seems to be particularly interested in technical aspects of these industries, including processor design, verification IP, thermal impacts assessment, and glitch power issues at advanced nodes.
Given her focus on industry-specific content and press releases related to the semiconductor field, she would likely be interested in receiving pitches from professionals who can provide deep insights into cutting-edge developments within this sector. These could include experts working with RISC-V architecture or those specializing in AI accelerator architectures.
As Ann doesn't have a specific geographic focus but covers topics relevant to international technology development trends within the semiconductor industry.
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As vehicle technology evolves, carmakers must decide which technologies move forward and what gets left behind.
The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex models.
Industry learning expands as more SoCs are disaggregated at leading edge, opening door to more third-party chiplets.
Cheap imports are ratcheting up pressure on traditional carmakers, but changes are more difficult than anticipated.
More efficient hardware, better planning, and better utilization of available power can help significantly.
Third party chiplets are hitting the market as chiplet models evolve. Who's calling the shots isn't clear yet.
By: Ann Mutschler
Increasing intelligence in vehicles is increasing reliance on some technologies that were sidelined in the past.
By: Ann Mutschler
Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial architectural planning stage; new tools may be needed.
By: Ann Mutschler
Silicon lifecycle management applications and techniques are gaining traction as chipmakers figure out how to more effectively use them.
By: Ann Mutschler
Carmakers and traditional tiered automotive suppliers are still grappling with how and when to move to software-first vehicle architectures.
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