Ed Sperling is the Editor in Chief of Semiconductor Engineering, a publication that covers the latest developments and challenges in the semiconductor industry. With a focus on technology and engineering, Ed's articles delve into topics such as thermal simulation, chip design, integration challenges, and power integrity.
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Ed Sperling's coverage is heavily focused on providing expert commentary and industry-specific insights into the engineering and design aspects of electronics, integrated circuits, chip design, data centers, and the semiconductor industry. He appears to be interested in addressing challenges and advancements within these domains.
Given his focus on expert commentary, Ed might be open to pitches from professionals who have deep technical knowledge or experience in areas such as 3D heterogeneous integration, DRAM technology complexities, power integrity challenges in next-gen designs, SerDes technologies for data centers, ESD mitigation strategies and reliability testing using deep data analysis.
As Ed does not specify a geographic focus but covers topics that are globally relevant within the semiconductor industry and related fields of engineering and design.
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Rest of Asia makes up difference, but causes for shift still unknown.
Strategies for dealing with increasing compute demands from AI and other applications.
Changes in software can be instantaneous, but the underlying platform needs to be robust, secure, and safe.
How chiplets and advanced packaging will affect power efficiency, and where design teams can have the biggest impact on energy consumption.
How faster processing is revolutionizing different industries.
New approaches to moving more data faster and more efficiently.
By: Ed Sperling
Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.
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